Laser Micromachining

What is Laser Micromachining?

Laser Micromachining is a precision manufacturing process that uses a laser beam to remove material at a microscopic scale. Machined parts can be relatively large whereas the structures produced, such as holes, grooves or shapes, may range between a few microns and a few millimeters. Depending on the optical setup, the size of the Laser tool is typically between 10 and 60 µm, which allows for processing of fine features in any kind of material, including very hard and brittle material.

Why come to GF Machining Solutions for Laser Micromachining?

With a strong expertise in software development and photonics, GF Machining Solutions continuously develops Laser systems inspired by 70 years of experience in state-of-the-art precision machining centers.

With the integration of Microlution in 2016, GF Machining Solutions has significantly reinforced its position in Laser Micromachining and is now an innovation and market leader.

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Most micromachining applications require ultra-short pulsed lasers, also called femto lasers. Building on 15 years of experience with femto lasers, GF Machining Solutions develops its own products - such as the Femto FlexiPulse™ - with the best Laser Manufacturers in the world.

Thanks to a global presence and unique know-how, GF Laser application engineers and the GF Academy are here to support you and help you realize the full potential of your application with a GF Laser machine.

Micro-engraving

This type of machining modifies the surface of a part, using a 3D definition of the pattern to be produced. With a 5-axis machine, the engraved surface can be very complex. Micro-engraving is popular in many industries such as mint, watchmaking and luxury goods, as well as for the manufacturing of semiconductors, mold and die, tooling and medical devices.

Micro-shaping

An ideal way to produce high precision shapes or cavities, Micro-shaping uses also a 3D definition of the volume to be removed. Micro-shaping goes beyond by allowing higher accuracy and larger part size as well more possibilities in terms of shapes and surface finish. A perfectly complement to EDM and Milling, Micro-Shaping allows producing micro-molds, micro-tools and parts made of very hard material with small details and sharp edges.

Micro-cutting

Used in many applications requiring features with high precision, Micro-cutting permits achieving tight tolerances on materials that are generally with less than 2 mm thickness. These type of features are found in a wide range of industries such as fine aerospace, medical devices, ICT and electronic components.

Micro-drilling

Micro-drilling encompasses a broad range of high-precision through-holes in industries such as ICT, automotive, medical and aerospace. Features range from 30-µm square holes to 300-µm thick ceramics, through 500 µm holes across 5 mm thick metals, all of which require repeatability, taper control and smooth surface finishes.

Main competitive advantages

Laser sources for each application

Offering both infrared and green femtosecond Lasers in order to optimize for your material and feature geometries. Take advantage of nanosecond Lasers for higher throughput and faster ROI. Get the best of both worlds with our dual source Laser solutions.

3- or 5-axis scanners

Our 3-axis beam delivery configuration allows for efficient machining by using a large field of view with high speed and quality. Our 5-axis beam delivery allows for repeatable cutting and drill of positive, zero and even negative tapered features.

Modular or turnkey solutions

Choose one of our many standard solutions to get your production running with very short lead times. Get from print to part by working with our experienced interdisciplinary team on a turnkey solution.

In-process metrology

Our integrated visions systems and touch probes provide for incoming part qualification and precise part positioning. Increase your margins by improving your yield and reducing your down-stream inspection.

Overview of the series

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LASER S series

Innovative texturing and accelerated productivity

LASER S 500 (U)

The ultimate Laser ablation tool

LASER P 400

Design for extreme accuracy and uncompromising quality

ML-5

Achieve excellent edge and surface quality and straight sidewalls

ML-10

Ultimate work space maximization for aerospace applications

MLTC

Simplify complex machining processes in cutting tubes for medical applications

Our range of Laser micromachining machines

Micro-engraving/Micro-shaping
Micro-cutting
Micro-drilling

Micro-engraving/shaping Micro-cutting Micro-drilling

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LASER P and S
Machine
XYZ (mm)
A/B or B/C travel
Laser sources
Machine XYZ (mm)
A/B or B/C travel
Laser sources
LASER P 400 600 x 400 x 300
-
Femto / Nano / Femto + Nano
LASER P 400 U 600 x 400 x 300
+115-105°/720°
Femto / Nano / Femto + Nano
LASER S 500 550 x 400 x 500
-
Femto / Nano / Femto + Nano
LASER S 500 (U)
 550 x 400 x 500
B/C: -110/+110°; 0/720°
Femto / Nano / Femto + Nano
LASER S 1000 U 1000 x 550 x 880
180°/720°
Femto / Nano / Femto + Nano
LASER S 1200 U 1200 x 900 x 970
180°/720°
Femto / Nano / Femto + Nano

ML-5 / ML-10 / MLTC
Machine
XYZ (mm)
A/B or B/C travel
Laser sources
Machine XYZ (mm)
A/B or B/C travel
Laser sources
ML-5 300 x 380 x 270
A +95°-125° / C 360°
Femto
ML-10 600 x 600 x 500
B +135°-45° / C 360°
Femto / Nano
MLTC 280 x 20 x 24
A 360° continuous
Femto / High power fiber laser

Application possibilities

Spinnerets

Reduce your cost per part by directly machining the final part without any consumable. Complex zero taper features can be easily machined without the need for precise electrodes or micro-drills. Achieve any geometry by simply loading a new part program.

High flatness levels

Smart CAM software, high machine stability and using the highest standard of femtosecond laser sources are the keys to mastering the most challenging geometrical tolerances especially in high-precision industries such as medical, watchmaking or ICT. Achieve typical values of flatness tolerance -/+ 3 µm and 3D surface roughness Sa 0.23 µm.

Hard material machining

From hard metals to ceramics and glass, machine any type of material in your semiconductor and electric component applications, thanks to our femtosecond and nanosecond laser sources, also available in a dual laser configuration.

Finest details for consumer electronics

From concept to part, program easily your toolpath thanks to our powerful LaserSUITE360 complete software solution and achieve the finest level of details.

Probe cards

The miniaturization of electronic components requires machining smaller and more precise features. Our ML-5 ultrafast Laser micromachining platform is able to achieve inside-corner radii below 3 μm and zero taper sidewalls to keep up with manufacturer demands.

Watch components

Consisting of hundreds of extremely small, tight-tolerance components, watch movements require the use of ultrafast Laser micromachining solutions to achieve lower costs, faster cycle times, and increased productivity in comparison with traditional machining methods.

Car lighting

With the ability to produce sharp details as well to engrave large molds, our femto 5-axis LASER S 1200 U machining center, operating in the green wavelength, allows rapid prototyping with direct engraving on polymers, permits controlling shiny effects and respecting surface integrity.

Blind features

Eliminate unnecessary operations using Laser Micromachining for blind features. Cut profiles, drill holes and machine any blind features, all in a single setup.

Precise 5-axis positioning

Achieve feature repeatability and exact positioning. Built-in vision systems and touch probes ensure the incoming part is measured and qualified to achieve tight positioning tolerances.

Small parts, high volume production

Run a lights-out production on parts with outer diameters down to 0.3 mm thanks to the small tube handling system of the MLTC Laser tube-cutting platform

wafer chuck application global view

Semiconductors – Wafer chuck

+ Material: silicon carbide
+ Laser (type/power): GF Nano Flexipulse™ 50 W
+ Software: LaserCAMTM
+ Measured surface flatness: 0.003 mm
+ Average measured depth: 0.186 mm

ICT connector application global view

ICT – Connector

+ Material: tungsten carbide
+ Laser (type/power): GF Femto Flexipulse™ 40 W IR
+ Software: LaserCAMTM
+ Surface roughness: ± 0.15 µm
+ Measured depth: 1.004 mm

Medical

Miniaturization is a clear trend and the accuracy of features is becoming even more crucial. Our high-precision Laser Micromachining platforms answer medical device manufacturers' needs for productivity, quality and compliance with stringent regulations.

Aerospace

Novel bulk materials and thermal barrier coatings require a new approach to machining aerospace components. Our Laser solutions allow for processing metering holes, diffuser geometries and seal slots on nearly any material.

EC/ICT

Wafer chucks are made out of metals such as aluminum or steel, or more exotic materials such as silicon carbide or glass. Our Laser processes allow for precise machining of holes, slots, pins and grooves to ensure safe handling of high-value silicon wafers.

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